MicroCraft
Option
Latent Testing
The Latent Test is a tremendously fabulous method, which not only detects the existing defects but also the dormant ones having the possibility of becoming a permanent defect in the near future. This in turn enhances the production reliability.
Non linear Conductivity caused by a change in resistance due to the increase in current induced temperature.
Basic Principle Detectable Defects
Micro Short Detection
In Isolation test, a sudden application of high voltage may result in burning out of parts containing Micro short and it may happen that the carbonized residue may react with water particles in the air or gases inside the factory and may cause the element to relapse as high resistance short error after the completion of the test. Our Micro-short test avoids such damage and trouble by applying a low voltage less than 30V before applying the high. Again, the high resistance short between multiple layers of a board may possess the characteristics of semiconductor and capacitors. These errors can also be detected in our test by reversing the polarity of high voltage.
Micro Short Detection
High-Volt Isolation Resistance Measurement Unit
EMMA series testers come standard with 250 volts. All EMMA units are field up-gradable to 500 volts or 1000 volts. 500 volt measuring unit is adjustable in 1-volt increments and 1000 volt one is adjustable in 4-volt increments.
Hipot Testing
If HIPOT meter is installed to ELX6146 through GPIB interface, application of high voltage, as much as 5000 volt, is feasible.
Precision Resistance Measurement Unit
4wire - 4point measurement
A 4 wire, 4 point measurement utilizing Kelvin Probe is available as an option. Also, a Buried Resistance option can measure and store buried resistance.
Range Resolution Practical range Current Option
0-40mΩ
0.01mΩ
3-30mΩ
125mA
Kelvin Probe
0-400mΩ
0.1mΩ
30-300mΩ
125mA
Kelvin Probe
0-4Ω
1mΩ
0.3-3Ω
125mA
Kelvin Probe
0-10Ω
2.5mΩ
0.5-8Ω
10mA
0-100Ω
25mΩ
5-80Ω
10mA
0-1000Ω
250mΩ
50-800Ω
2.65mA
0-10kΩ
2.5Ω
500-8kΩ
0.265mA
0-100kΩ
25Ω
5k-80kΩ
26.5µA
Buried Resistance
0-1MΩ
250Ω
50k-800kΩ
2.65µA
Buried Resistance
Contact Check During Isolation Testing
Contact Check During Isolation Testing
This feature enables you to verify good probe contact with pad before test. This improves the accuracy of isolation testing. Furthermore, this feature allows for pad searching function as well.
Multiple Fiducial
Multiple Fiducial
Large panel small image testing is achieved with our single or multiple fiducial feature. Operators can select one set of fiducial per panel or per image. To increase productivity, images can be knocked out for No Test or No Alignment.
Regional Fiducial
Regional Fiducial
Several additional fiducials (up to 100) are added to take care of the warps produced in the high frequency ceramic substrate boards. Application of spline interpolation process allows high accuracy positional corrections.
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